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august 2014 docid023971 rev 3 1/13 AN4211 application note guidelines for soldering mems microphones by alessandro morcelli introduction this application note provid es guidelines and recommendations for soldering mems microphones on application boards. microp hones, as pressure sensors, sense the mechanical stress coming from the pcb, henc e this force should be kept to a minimum. printing and stencil parameters, followed by device footprints, recommended land and stencil patterns, and process considerati ons are presented in this document. the following guidelines have been developed for the mems microphone family (mp45dt02, mp34db01, mp34dt01, mp33ab01, and mp33ab01h) offered by stmicroelectronics. demonstration boards (steval-mki129vx) fo r the evaluation and promotion of the mp45dt02, mp34dt01, and mp34dt01 are also available. please refer to an4184 "microphone coupon boards steval-mki1 29vx based on the mp45dt02, mp34db01, and mp34dt01" on www.st.com for further information. figure 1. mechanical specifications for soldering www.st.com
contents AN4211 2/13 docid023971 rev 3 contents 1 printing and stencil parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 device footprint, land pattern and stencil openings . . . . . . . . . . . . . . . 4 2.1 mp45dt02 and mp45dt02-m dimensions . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 mp34db01 and mp34db02 dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.3 mp34dt01 and mp34dt01-m dimensions . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 mp33ab01 and mp33ab01h dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.5 mp34db02 dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6 mp23ab02 dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3 process considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
docid023971 rev 3 3/13 AN4211 printing and stencil parameters 13 1 printing and stencil parameters the soldering paste thickness and pattern are important for the proper microphone soldering process. here below, some recommendations to be followed are listed: ? stainless steel stencils are recommended ? stencil thickness of 75 - 100 m (2.95 - 3.94 mils) is recommended for screen printing ? the final soldering paste thickness should a llow proper cleaning of flux residuals and clearance between the sensor package and pcb ? stencil aperture should have a rectangular shape ? the openings of the stencil for the signal pa ds should be between 70 - 90 % of the pcb pad ? optionally, for better solder paste release, the aperture walls should be trapezoidal and the corners rounded ? the fine ic leads pitch requires accurate alignment of the stencil to the pcb. the stencil and printed circuit assembly should be aligned to within 25 m (1 mil) prior to application of the solder paste
device footprint, land pattern and stencil openings AN4211 4/13 docid023971 rev 3 2 device footprint, land pattern and stencil openings 2.1 mp45dt02 and mp 45dt02-m dimensions figure 2. mp45dt02 - device footprint and pcb land pattern figure 3. mp45dt02 - recommended stencil openings
docid023971 rev 3 5/13 AN4211 device footprint, land pattern and stencil openings 13 2.2 mp34db01 and mp34db02 dimensions figure 4. mp34db01 - device footprint and pcb land pattern figure 5. mp34db01 - recommended stencil openings
device footprint, land pattern and stencil openings AN4211 6/13 docid023971 rev 3 figure 6. mp34db02 - device footprint and pcb land pattern figure 7. mp34db02 - recommended stencil openings note: the hole position is slight ly different for the mp34db02, pl ease refer to the datasheet for reference.
docid023971 rev 3 7/13 AN4211 device footprint, land pattern and stencil openings 13 2.3 mp34dt01 and mp 34dt01-m dimensions figure 8. mp34dt01 - device footprint and pcb land pattern figure 9. mp34dt01 - recommended stencil openings
device footprint, land pattern and stencil openings AN4211 8/13 docid023971 rev 3 2.4 mp33ab01 and mp 33ab01h dimensions figure 10. mp33ab01 and mp33ab01h - device footprint and pcb land pattern figure 11. mp33ab01 and mp33ab01h - recommended stencil openings
docid023971 rev 3 9/13 AN4211 device footprint, land pattern and stencil openings 13 2.5 mp34db02 dimensions figure 12. mp34db02 - device footprint figure 13. mp34db02 - recommended stencil opening
device footprint, land pattern and stencil openings AN4211 10/13 docid023971 rev 3 2.6 mp23ab02 dimension figure 14. mp23ab02 - device footprint figure 15. mp23ab02 recommended stencil openings
docid023971 rev 3 11/13 AN4211 process considerations 13 3 process considerations if self-cleaning solder paste is not used, proper cleaning of the board after soldering must be done to remove any possible source of leakage between pads due to flux residues. for the soldering profile, refer to the table and figure below. figure 16. soldering profile no solder material reflow on the side of th e package is allowed since lga packages show metal trace out of the package side. table 1. soldering profile description parameter pb free average ramp rate t l to t p 3 c/sec max preheat minimum temperature t smin 150 c maximum temperature t smax 200 c time (t smin to t smax )t s 60 sec to 120 sec ramp-up rate t smax to t l time maintained above liquidus temperature t l 60 sec to 150 sec liquidus temperature t l 217 c peak temperature t p 260 c max time within 5 c of actual peak temperature 20 sec to 40 sec ramp-down rate 6 c/sec max time 25 c (t25 c) to peak temperature 8 minutes max t25c to peak ramp-down ramp-up t s preheat t l t p critical zone t l to t p t smax t smin time t p t l temperature 30 60 90 120 150 180 210 240 270 300 330 360 390 am045166v1
revision history AN4211 12/13 docid023971 rev 3 4 revision history table 2. document revision history date revision changes 12-mar-2013 1 initial release. 21-jul-2014 2 added section 2.5 on page 9 and section 2.6 on page 10 . 08-aug-2014 3 modified figure 11 on page 8 .
docid023971 rev 3 13/13 AN4211 13 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved

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